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  this is preliminary information on a new product foreseen to be developed. details are subject to change without notice. july 2013 docid025074 rev 1 1/12 STL23NS3LLH7 n-channel 30 v, 0.0027 typ., 23 a stripfet? vii deepgate? power mosfet plus monolithic schottky in a powerflat? 3.3 x 3.3 datasheet - target specification figure 1. internal schematic diagram features ? very low on-resistance ? very low q g ? high avalanche ruggedness ? embedded schottky diode applications ? switching applications description this device exhibits low on-state resistance and capacitance for improved conduction and switching performance. powerflat? 3.3 x 3.3 1 2 3 4 8 123 4 7 6 5 d(5, 6, 7, 8) g(4) s(1, 2, 3) am15903v1 order code v ds r ds(on) max i d STL23NS3LLH7 30 v 0.0027 23 a table 1. device summary order code marking package packaging STL23NS3LLH7 23ns3 powerflat tm 3.3x3.3 tape and reel www.st.com
contents STL23NS3LLH7 2/12 docid025074 rev 1 contents 1 electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
docid025074 rev 1 3/12 STL23NS3LLH7 electrical ratings 12 1 electrical ratings table 2. absolute maximum ratings symbol parameter value unit v ds drain-source voltage 30 v v gs gate-source voltage 20 v i d (1) 1. this value is rated according to r thj-c drain current (continuous) at t pcb = 25 c 23 a i d (1) drain current (continuous) at t pcb = 100 c 14.3 a i dm (1)(2) 2. pulse width limited by safe operating area. drain current (pulsed) 92 a p tot (1) total dissipation at t c = 25 c 50 w p tot (3) 3. this value is rated according to r thj-pcb total dissipation at t pcb = 25 c 2.9 w t j max. operating junction temperature -55 to 150 c table 3. thermal data symbol parameter value unit r thj-pcb (1) 1. when mounted on fr-4 board of 1 inch2, 2oz cu, t < 10 sec thermal resistance junction-pcb max 42.8 c/w r thj-case thermal resistance junction-case max 2.5 c/w
electrical characteristics STL23NS3LLH7 4/12 docid025074 rev 1 2 electrical characteristics (t c = 25 c unless otherwise specified) table 4. on /off states symbol parameter test conditions min. typ. max. unit v (br)dss drain-source breakdown voltage i d = 1 m a , v gs = 0 30 v i dss zero gate voltage drain current v gs = 0 v v ds = 24 v 500 a i gss gate-body leakage current v gs = 20 v, v ds = 0 100 na v gs(th) gate threshold voltage v ds = v gs , i d = 1 ma 1.2 2.3 v r ds(on) static drain-source on-resistance v gs = 10 v, i d = 11.5 a 0.0027 0.0034 v gs = 4.5 v, i d = 11.5 a 0.004 0.005 table 5. dynamic symbol parameter test conditions min. typ. max. unit c iss input capacitance v ds = 15 v, f = 1 mhz, v gs = 0 -2080-pf c oss output capacitance - 660 - pf c rss reverse transfer capacitance -34-pf q g total gate charge v dd = 10 v, i d = 23 a, v gs = 4.5 v (see figure 3 ) -13-nc q gs gate-source charge - 6.7 - nc q gd gate-drain charge - 2.5 - nc table 6. switching times symbol parameter test conditions min. typ. max. unit t d(on) turn-on delay time v dd = 15 v, i d = 11.5 a, r g = 3 , v gs = 4.5 v -10-ns t r rise time - 33 - ns t d(off) turn-off delay time - 22 - ns t f fall time - 7.5 - ns
docid025074 rev 1 5/12 STL23NS3LLH7 electrical characteristics 12 table 7. source drain diode symbol parameter test conditions min. typ. max. unit i sd source-drain current - 23 a i sdm (1) 1. pulse width limited by safe operating area. source-drain current (pulsed) - 92 a v sd (2) 2. pulsed: pulse duration = 300 s, duty cycle 1.5% forward on voltage i sd = 2 a, v gs = 0 - 0.4 0.7 v t rr reverse recovery time i sd = 2 a, di/dt = 100 a/s v gs = 0 v - 31.2 ns q rr reverse recovery charge - 18.7 nc i rrm reverse recovery current - 1.2 a
test circuits STL23NS3LLH7 6/12 docid025074 rev 1 3 test circuits figure 2. switching times test circuit for resistive load figure 3. gate charge test circuit figure 4. test circuit for inductive load switching and diode recovery times figure 5. unclamped inductive load test circuit figure 6. unclamped inductive waveform figure 7. switching time waveform am01468v1 v gs p w v d r g r l d.u.t. 2200 f 3.3 f v dd am01469v1 v dd 47k 1k 47k 2.7k 1k 12v v i =20v=v gmax 2200 f p w i g =const 100 100nf d.u.t. v g am01470v1 a d d.u.t. s b g 25 a a b b r g g fast diode d s l=100 h f 3.3 1000 f v dd am01471v1 v i p w v d i d d.u.t. l 2200 f 3.3 f v dd am01472v1 v (br)dss v dd v dd v d i dm i d am01473v1 v ds t on td on td off t off t f t r 90% 10% 10% 0 0 90% 90% 10% v gs
docid025074 rev 1 7/12 STL23NS3LLH7 package mechanical data 12 4 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark.
package mechanical data STL23NS3LLH7 8/12 docid025074 rev 1 table 8. powerflat? 3.3 x 3.3 mechanical data dim. mm min. typ. max. a0.700.800.90 b0.250.300.39 c0.140.150.20 d3.103.303.50 d1 3.05 3.15 3.25 d2 2.15 2.25 2.35 e0.550.650.75 e3.103.303.50 e1 2.90 3.00 3.10 e2 1.60 1.70 1.80 h0.250.400.55 k0.650.750.85 l0.300.450.60 l1 0.05 0.15 0.25 l2 0.15 ? 8 10 12
docid025074 rev 1 9/12 STL23NS3LLH7 package mechanical data 12 figure 8. powerflat? 3.3 x 3.3 drawing bottom view side view top view 8465286_a
package mechanical data STL23NS3LLH7 10/12 docid025074 rev 1 figure 9. powerflat? 3.3 x 3.3 recommended footprint 8465286_footprint
docid025074 rev 1 11/12 STL23NS3LLH7 revision history 12 5 revision history table 9. document revision history date revision changes 31-jul-2013 1 first release.
STL23NS3LLH7 12/12 docid025074 rev 1 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not authorized for use in weapons. nor are st products designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statem ents and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - swed en - switzerland - united kingdom - united states of america www.st.com


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